NOVEL APPROACH FOR PROCESS CHAMBER COATINGS TO IMPROVE OEE AND REDUCE DEFECTS
Drs. E. Ryabova, N. Wang, M. Shkolnikov, A. Skumanich | SemiCon West Conference, July 12, 2012, San Francisco, CA, USA
An Innovative technology is introduced which improves upon the current chamber protective coatings in semi processing equipment. The novel protective coatings are shown to have several advanced capabilities as well as lower overall costs. The protective coatings are engineered to enable ULSI IC-device manufacturing at and below 22nm design pitch providing two levels of protection for chamber components that eliminates on-wafer defects and for contaminations. High purity fully conformal coatings are applied to the various exposed process chamber parts (shower head, liners, etc.) which can be attacked by the process gases and process environment. The desirable elements for these protective coatings are to withstand this attack and to reduce particle shedding or flaking and metal ion contamination. The key improvements with the novel protective coatings are: lower erosion rates, fully conformal coverage, longer lifetimes between PM's, reduced layer stress, reduced particulate development is anticipated as a result of the key features. In addition, the novel deposition method for the protective coatings allows for: complete coverage of even small features or high-aspect ratio features such as the openings in the shower heads, for improved thermal cycling, and also importantly for lower overall processing costs. The key improvements are: better OEE and overall wafer yield. The talk will outline the deposition approach, provide data on the improved coating functionality, and give an understanding of the cost benefits. A comparison will be made for some key parameters, such as erosion rate, against some standard chamber coatings. The overall implications for improved semi production will be expounded including the reduction in energy and materials for processing, the ability to scale to 450mm, and the enabling elements for the 20nm nodes.
LARGE AREA GLASS COATING FOR ENHANCED PROPERTIES AT LOWER COSTS BASED ON A NON-VACUUM APPROACH
Drs. E. Ryabova, N. Wang, A. Skumanich | 9th International conference on Coatings on Glass and Plastics, June 24, 2012, Breda, The Netherlands
A novel process is described which improves upon the current approach to coating deposition onto glass by using vacuum coating technologies. This method is achieved without vacuum and at room temperature to apply a range of nanocomposite, clear coatings onto large glass surfaces. The types of coatings include those for scratch and abrasion resistance, as well as other types of compounds, which can be used for anti-reflection (AR) and for Low-e types of films. The technology allows for the application of films over 3 meter square areas with a high throughput that allows for cost effective production implementation. It can be seamlessly integrated into existing glass manufacturing lines. Data will be presented on specific films for scratch and abrasion resistance. Various types of standard measurements are made which include Linear Tabor Abrasion test verified by Haze and Spectral Transmittance measurements, which address the ASTM standards. The results show that the films provide improved coatings with capabilities that meet the functionality requirements. Additional films are developed and discussed which address the AR and Low-e film stack requirements. The general aspects of the novel vacuum-free approach will be outlined and specific data presented. The cost comparisons to standard approaches based on PVD or CVD types of deposition will be highlighted. In addition the advantages as compared with PVD or CVD will be discussed in the context of providing film deposition capability for: large area (2m x 2m and beyond), production scale (more than 1Million sq meters/system/year), and process robustness. Specific superior properties are detailed, and interface engineering capabilities are highlighted for the variety of multilayer stack fabrication in a very economical way.